Philips CDI 310 EMC/EMI Testing Unit Part 2

Philips CDI 310 EMC/EMI Testing Unit Part 2

This second part continues the documentation of the Philips CDI 310 EMC/EMI Testing Unit with a detailed examination of the mainboard and the system ROM. It focuses on the electrical differences compared with the CDI 350, including removed components, altered circuits, and other modifications. If you have not read the teardown yet, you can find it in Part 1.

Originally being a CDI 350 mainboard, several components are not required in a CDI 310 — particularly those associated with the missing display and speakers. In addition to parts that were removed or replaced, many solder joints have been manually reworked, including most connectors and ground points.

Differences between 310 and 350 mainboards

To document the changes, I placed both mainboards side by side. Since I did not have an unaltered CDI 350 mainboard at hand, the board shown on the left has already been reworked according to my repair article. I chose one with a yellow silkscreen for easier comparison.

Each section was then examined individually, with differences first marked on printed schematics and later transferred into tables. Components are tagged with grid coordinates from the CDI 350 service manual. For orientation, two grid systems are used: the mainboard grid (Grid 1) and the section‑specific grids (Grid 2) found in schematic blocks such as Audio 2, Video 1, MMC 3, etc. Board sides (top = A, bottom = B) are also indicated. The sections do not follow the order of the service manual. I’ve added some comments as well, for example which functions or other components are affected.

Why go to all this trouble? Quite simply, I still have extensive work ahead removing the leaking SMD electrolytics and cleaning the board. When fitting new components to get the 310 working again, I can rely even less on the 350 service manual. These tables will be updated as further findings emerge during repair.

Power

Two of the Video 1 power rails — +5L and –8L, originally used for the LCD panel — have been taken out of service. The fuse for +12B Video 1 (LCD backlight) has been replaced, and this rail is now repurposed to supply +12 V to the FDD controller.

One interesting detail I’ll have to investigate during repair: the fusible component LP03 has been bridged. This suggests it may have blown during testing or while the speaker amplifier and related circuits were being removed.

Schematics reference: 6.4.4 Power/Audio Schematic Diagram (Part 2)

IDSideGrid1Grid2StatusNotes
CP14AB11A4removed+5L Video 1
CP15AB10A5removed+5L Video 1
CP16AB10A5removed+5L Video 1
CP25AB10C4removed-8L Video 1
CP26AD11C4removed-8L Video1
CP27AC11C5removed-8L Video 1
CP28BC2C5removed-8L Video 1
FP02AB10B3replaced+12B Video 1
ICP3AC10C4removed-8L Video 1
ICP4BB2A4removed+5L Video 1
LP03AC11D4bridged-8A Audio 1,2
QP01BC2B5reworked+10A Audio 1,2
RP09BB2A3removed+5L Video 1

Audio 2

Almost all components of the speaker amplifier have been removed. The entire audio output path for the internal speakers is gone, although the speaker connector — and a handful of passive SMD parts — remain in place.

Schematics reference: 6.4.4 Power/Audio Schematic Diagram (Part 2)

IDSideGrid1Grid2StatusNotes
C526AH1A15removedSpeaker Amp
C527AH1A15removedSpeaker Amp
C530AH1C15removedSpeaker Amp
C532AH2B15removedSpeaker Amp
C537AG2B16removedSpeaker Amp
C538AH2C16removedSpeaker Amp
C541AH1B13removedSpeaker Amp
C543AG1B16removedSpeaker Amp
C546AI1B14removedSpeaker Amp
C547AH1B15removedSpeaker Amp
D553BH12B13removedSpeaker Amp
IC60AH1B15removedSpeaker Amp
IC61BH11B15removedSpeaker Amp
L502AI6A16reworkedAudio L Out
L503AI2E17reworkedHeadphone R Out
L504AI4E17reworkedHeadphone L Out
Q517BI12B14removedSpeaker Amp
Q518BH12C14removedSpeaker Amp
R522BH10C16removedSpeaker Amp
R524BG11B16removedSpeaker Amp
R533BI11C14removedSpeaker Amp
R534BH11C14removedSpeaker Amp
R543AI1B14removedSpeaker Amp
R544BG10B16removedSpeaker Amp
R545BH11C14removedSpeaker Amp
R546BH10C16removedSpeaker Amp
R548AI1B14removedSpeaker Amp
R549BH12C14removedSpeaker Amp
R576BH12B14removedSpeaker Amp
R577BH12B14removedSpeaker Amp
R578BH12B14removedSpeaker Amp

Video 1

Most of the changes relate to connector J402, to which the FFC for the LCD is connected on the 350. On the 310, the FDD controller is connected there instead, and naturally it does not require any video signals. Components responsible for switching between internal and external video, brightness control, and other display-related functions have been removed entirely.

Basically, the original purpose of J402 has become obsolete or has been reconfigured. It now supplies the FDD controller with +12 V.

Schematics reference: 6.4.5 Video Schematic Diagram (Part 1)

IDSideGrid1Grid2StatusNotes
C451AE9C8replaced?J402 pin 21 DISPC and pin 24 GNDB
C453AG8B7replacedFrom +5L to J402 pin 11+24
C454AG8A7replacedJ402 pin 5 -8VL to GND
C455BF4A7replaced?J402 pin 14 VSW to GND
C456BF4C3replaced?J402 pin 12 VCDC to GND
C457AG8B7removedFrom +5L to J402 pin 11+24
C458AG8A7removedFrom -8L to GND
C461BG5A3removedIC48 / +5L to GND
C462AE9E7replaced?J402 pin 9 BRT (Brightness) to GND
IC48BG5B3removedSwitches CS int/ext – to J402 pin 10 CS
J993BD4C7removedHSLCD and VSLCD – to J402 pins 19 VS and 20 HS
L451AF9D8removedJ402 pin 8 RTU (Video signal from J404)
L452BF4D8removedJ402 pin 7 – GTU (Video signal from J404)
L453BF4D8removedJ402 pin 6 – BTU (Video signal from J404)
L454AF8D8replaced?J402 pin 4 RCDI (Video signal from VSD)
L455AF8D8replaced?J402 pin 3 – GCDI (Video signal from VSD)
L456AF8D8replaced?J402 pin 2 – BCDI (Video signal from VSD)
L457BF4C3removedfrom ext SW to J402 pin 14 VSW
L458AG7B7removedFrom +5L to J402 pin 11+24 +5L
L459AG8A7removedFrom -8L tp J402 pin 5 -8VL
R450BG4B2removedIC48 / CS input
R451BG5B2removedIC48 / GND to input
R452BG4B2removedIC48 / GND to input
R457AG7E7replacedBetween GND and J402 pin 4 RCDI
R458AG7E8replacedBetween GND and J402 pin 3 GCDI
R459AG7E9replacedBetween GND and J402 pin 2 BCDI
R472BI4E6removedBetween +5L and RV41
R473BI4E6removedBetween GND and RV41
R478BF4B4removedTo J402 pin 10 CS
R479BF4n/apopulated?
R481AG8A7removedFrom -8L to RV42
R482AE9C7removedJ402 pin 21 DISPC
RV41AH9E6removedFrom +5L & GND to J402 pin 9 BRT (Brightness)
RV42AG8A7removedFrom -8L & +5L to J402 pin12 VCDC

Miscellaneous

Additional changes appear across several sections. The DISPC components, which control display on/off switching in MMC 3, are absent. In MMC 1 and MMC 3, clock signal pins of the VSD, VSC and CPU have been lifted and reattached. The VSD still carries a small SMD capacitor (likely around 1 pF) between the lifted pin and the mainboard.

Several other components show visible rework. I have listed the most relevant ones in the table, although not every single re‑soldered part is included — there are simply too many minor touch‑ups to document individually. The purpose of some of the modifications is not entirely clear, but they suggest that tests were carried out during pre-production and EMC/EMI evaluation in which certain functions were disabled, bypassed or temporarily deactivated.

Below are a few selected photos of these changes; additional examples can be found in the earlier sections.

Schematics references:
6.4.3 Audio Schematic Diagram (Part 1)
6.4.7 MMC Schematic Diagram (Part 1)
6.4.9 MMC Schematic Diagram (Part 3)
6.4.2 Servo Schematic Diagram

6.4.6 Video Schematic Diagram (Part 2)

IDSideGrid1SectionGrid2StatusNotes
C726AG10Audio 1D7replaced?Filter IC71
C727AG10Audio 1D7replaced?Filter IC72
C732AH10Audio 1B7replaced?Filter IC72
C741AG10Audio 1D7replaced?Filter IC71
C742AH10Audio 1B7replaced?Filter IC72
C435AE4MMC 1B10replaced?From +5R to VSD pin 81 VDD2
IC40BB4MMC 1B4pin liftedVSC pin 119 XTAL1
IC42BB6MMC 1B2pin liftedVSC pin 119 XTAL1
IC44BD8MMC 1B9pin liftedVSD pin 55 XT2
L401AE6MMC 1A10reworkedFrom +5R to VSD pin 81 VDD2
C107AF8MMC 3F13removedSYSCLK to CPU
C108AF8MMC 3G13removedSYSCLK to FMV
C109AF8MMC 3G13removedSYSCLK to VSC
IC01AC7MMC 3B9pin liftedSCC pin 30 XTAL_1 / SYSCLK
QF04BF8MMC 3E4removedDISPC
R119AF8MMC 3F13replacedSYSCLK to CPU
R120AF8MMC 3G13replacedSYSCLK to FMV
R121AF8MMC 3G13replacedSYSCLK to VSC
RF19BF8MMC 3E4removedDISPC
RF20BF9MMC 3E4removedDISPC
RF21BF8MMC 3E5removedDISPC
SWF1AI8MMC 3B1removedSignal KEY03, KEY13 (Display on/off)
X101BC4MMC 3E9reworkedSCC68070
C811BA11ServoB4replaced?Between +5S and IC80
C814BC11ServoB5replaced?Between IC80 and IC82
C821BC10ServoE3replaced?Between REF and IC81
C822BC10ServoE3replaced?Between REF and IC81
L904BI6Video 2C15reworkedCVBS OUT
L905BI7Video 2D15reworkedY OUT
L906BI8Video 2F15reworkedC OUT
R973BF11Video 2?n/areplacednext to IC93

Comparison with a regular 310 mainboard

Here is a photo of a regular CDI 310 main chassis (courtesy of CD-i Fan); the mainboard fitted to it has a white silkscreen. No subsequent soldering work is visible, and it was in fact manufactured without the missing components listed above. On closer inspection, further components are absent as well, such as R532 from the speaker amplifier and C459/C460 from the Video 1 section — which makes sense, as these components belong to circuits that have been completely removed.

Philips CDI 310 main chassis
Philips CDI 310 main chassis

Although this comparison is useful, it is based on a single photo of a regular CDI 310 mainboard. A thorough examination of a standard production unit — ideally from all sides and with detailed close‑ups — would be valuable whenever the opportunity arises. It would help confirm which components were never fitted on the 310, which differences are consistent across units, and which may vary between production batches.

System ROM

And finally, a look at the pre-release system ROM R1.1, which carries a handwritten sticker with the date 93-7-10 and checksum B706. Since the serial connection with CD-i Link could not be established, the IC had to be desoldered and dumped the old-fashioned way using an EPROM burner. It’s a Toshiba TC544200F-150 OTP ROM, which can be read using a TC574200D or 27C400 driver.

According to CD-i Fan, the only difference compared with the regular CDI 310 system ROM (cdi310a12) is a missing shell module.

Modules and checksums:

Conclusion

This concludes the first two parts in a series of articles on the Philips CDI 310 EMC/EMI Testing Unit. All major assemblies have now been taken apart and documented, including the mainboard, FDD controller and system ROM.

Although very few people will ever have the opportunity to repair a CDI 310, the tables listing removed and modified components may still be useful for converting a CDI 350 with a faulty display into a fully functional unit without a display.

The next article(s) will focus on repair work, capacitor replacement and the practical operation of this unit.

Credits

Many thanks to CD-i Fan for providing information and photos of a regular CDI 310 model, as well as analysis of the system ROM.

History

2026-09-02: Initial version published

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